The effect of network topology on material properties in vinyl-ester/styrene thermoset polymers using molecular dynamics simulations and time–temperature superposition
The time–temperature superposition principle (TTSP) is a promising tool for filling the time-scale gap between molecular dynamics simulation and experiments in polymer systems. Here we propose a molecular dynamics approach to generate vinyl-ester (VE)/styrene (ST) thermoset modulus master curves that are comparable to experiments.