by Evoy, S., DiLello, N., Deshpande, V., Narayanan, A., Liu, H., Riegelman, M., Martin, B. R., Hailer, B., Bradley, J. C., Weiss, W., Mayer, T. S., Gogotsi, Y., Bau, H. H., Mallouk, T. E. and Raman, S.
Reference:
Dielectrophoretic assembly and integration of nanowire devices with functional CMOS operating circuitry (Evoy, S., DiLello, N., Deshpande, V., Narayanan, A., Liu, H., Riegelman, M., Martin, B. R., Hailer, B., Bradley, J. C., Weiss, W., Mayer, T. S., Gogotsi, Y., Bau, H. H., Mallouk, T. E. and Raman, S.), In Microelectronic Engineering, volume 75, 2004.
Bibtex Entry:
@article{85,
author = {Evoy, S. and DiLello, N. and Deshpande, V. and Narayanan, A. and Liu, H. and Riegelman, M. and Martin, B. R. and Hailer, B. and Bradley, J. C. and Weiss, W. and Mayer, T. S. and Gogotsi, Y. and Bau, H. H. and Mallouk, T. E. and Raman, S.},
title = {Dielectrophoretic assembly and integration of nanowire devices with functional CMOS operating circuitry},
journal = {Microelectronic Engineering},
volume = {75},
number = {1},
pages = {31},
ISSN = {0167-9317},
DOI = {10.1016/j.mee.2003.09.010},
year = {2004},
date= {07/01}
type = {Journal Article}
}
Dielectrophoretic assembly and integration of nanowire devices with functional CMOS operating circuitry
