Physical layer key based interleaving for secure wireless communication

by Kapil R. Dandekar, James J. Chacko, Kyle Joseph Juretus, Marko Jacovic, Cem Sahin, Nagarajan Kandasamy and Ioannis Savidis

View PDF

Reference:

K. R. Dandekar, J. J. Chacko, K. J. Juretus, M. Jacovic, C. Sahin, N. Kandasamy, I. Savidis, “Physical layer key based interleaving for secure wireless communication”, Granted patent US-11540120-B2, 2022.

Bibtex Entry:

@patent{US-11540120-B2,
     number = {US-11540120-B2},
     type= {Granted Patent},
     title = {Physical layer key based interleaving for secure wireless communication },
     author = {Kapil R. Dandekar and James J. Chacko and Kyle Joseph Juretus and Marko Jacovic and Cem Sahin and Nagarajan Kandasamy and Ioannis Savidis},
     date= {2022-12-27},
     year= {2022},
     url= {https://patents.google.com/patent/US11540120B2/en}
}