Innovative propagation mechanism for inter-chip and intra-chip communication

by Y. Liu, V. Pano, D. Patron, K. Dandekar and B. Taskin

Reference:

Y. Liu, V. Pano, D. Patron, K. Dandekar, B. Taskin, “Innovative propagation mechanism for inter-chip and intra-chip communication”, In 2015 IEEE 16th Annual Wireless and Microwave Technology Conference (WAMICON), pp. 1-6, 2015.

Bibtex Entry:

@INPROCEEDINGS{7120367, 
author={Y. Liu and V. Pano and D. Patron and K. Dandekar and B. Taskin}, 
booktitle={2015 IEEE 16th Annual Wireless and Microwave Technology Conference (WAMICON)}, 
title={Innovative propagation mechanism for inter-chip and intra-chip communication}, 
year={2015}, 
volume={}, 
number={}, 
pages={1-6}, 
keywords={antennas;elemental semiconductors;radio networks;silicon;system-on-chip;inter-chip communication;intra-chip communication;SoC;system on chip;wireless network interconnection;on-chip antenna;radiation efficiency;transmission gain;conductive loss;radio waves;wireless interconnects;PCB;printed circuit board;Si;Silicon;Receiving antennas;Transmitting antennas;Media;Multimedia communication}, 
doi={10.1109/WAMICON.2015.7120367}, 
ISSN={}, 
month={April},}