TSV-W for 2.5-D IC Wireless Interconnects – Drexel Wireless Systems Lab

by Anim, Kyei, Taskin, Baris, Ganguly, Amlan and Dandekar, Kapil R.

Reference:

K. Anim, B. Taskin, A. Ganguly, K. R. Dandekar, “TSV-W for 2.5-D IC Wireless Interconnects”, IEEE Transactions on Very Large Scale Integration (VLSI) Systems, pp. 1-11, 2026.

Bibtex Entry:

@ARTICLE{11663341,
  author={Anim, Kyei and Taskin, Baris and Ganguly, Amlan and Dandekar, Kapil R.},
  journal={IEEE Transactions on Very Large Scale Integration (VLSI) Systems}, 
  title={{TSV-W} for 2.5-{D IC} Wireless Interconnects}, 
  year={2026},
  volume={},
  number={},
  pages={1-11},
  keywords={Through-silicon vias;Switches;Joining processes;Integrated circuits;Very large scale integration;Radio frequency;Arrays;Distance measurement;Design methodology;Modeling;2.5-D integrated circuit (IC);antenna design;finite element method (FEM) simulations;wireless interconnects;wireless networks on chip},
  doi={10.1109/TVLSI.2026.3716542}}