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'''What is Wireless On-Chip Interconnect?'''
=What is Wireless On-Chip Interconnect?=
Ankit More and Baris Taskin
[http://vlsi.ece.drexel.edu]
Drexel University


Wireless on-chip interconnects are a radio-frequency (RF) alternative
Wireless on-chip interconnects are a radio-frequency (RF) alternative to metal interconnects for global communication on an IC. RF interconnect channels are based on:
to metal interconnects for global communication on an IC. RF
interconnect channels are based on:


1. On-chip micro-strip transmission lines [1],
# On-chip micro-strip transmission lines [1],
2. On-chip antennas [2],
# On-chip antennas [2],
3. On-chip inductors based inductive coupling [3],
# On-chip inductors based inductive coupling [3],
4. On-chip capacitors based capacitive coupling [4].
# On-chip capacitors based capacitive coupling [4].


The micro-strip lines are used as guided-wave RF interconnects (RF-I[1])
The micro-strip lines are used as guided-wave RF interconnects (RF-I[1]) on a layer for lateral communication whereas the other three are configured as wireless RF interconnects used for lateral or vertical communication.
on a layer for lateral communication whereas the other three are
configured as wireless RF interconnects used for lateral or vertical
communication.


The wireless interconnects are not envisioned to antiquate the metal
The wireless interconnects are not envisioned to antiquate the metal based interconnects but rather to be implemented in conjunction to provide hybrid communication structures and networks-on-chip (NoC), particularly for 2D or 3D multi-processor system-on-chips (MPSoCs). The design of the wireless RF interconnects for all systems in general but for multi-core systems in particular requires considerations across a vast variety of subjects including, electro-magnetic theory, network theory, wireless communication, VLSI design and design automation. The multi-faceted design considerations are categorized according to three primary design paradigms [5]:
based interconnects but rather to be implemented in conjunction to
provide hybrid communication structures and networks-on-chip (NoC),
particularly for 2D or 3D multi-processor system-on-chips (MPSoCs).
The design of the wireless RF interconnects for all systems in general
but for multi-core systems in particular requires considerations
across a vast variety of subjects including, electro-magnetic theory,
network theory, wireless communication, VLSI design and design
automation. The multi-faceted design considerations are categorized
according to three primary design paradigms [5]:


P-1) Information Networking Paradigm: The information networking
; P-1) Information Networking Paradigm: The information networking paradigm considers higher level hybrid architectural design variables:
paradigm considers higher level hybrid architectural design variables:
(a) the architecture of the hybrid NoC using the wireless interconnects,
(b) the number of wireless nodes and the arbitration protocol,
(c) the placement of the wireless nodes in a given network topology
constrained to the maximum possible communication distance,
(d) the protocol to select the wireless short-cut path over the wired
path.


It is proposed in [6], for instance, that the entire network be broken
:: (a) the architecture of the hybrid NoC using the wireless interconnects,
up into subnets of computational cores with top-level hubs connected
with wireless ports for the high speed links conforming to a
small-world topology. Protocols for a collision free and quality of
service (QoS)-aware hybrid wireless NoCs, in presence of multiple
antennas at the same carrier frequency, are presented in [7].


P-2) Physical Implementation Paradigm: The physical implementation
:: (b) the number of wireless nodes and the arbitration protocol,
paradigm considers both the antenna design and the transceiver
design. The antenna and the transceiver design depend on:
(a) the carrier frequency and the required bandwidth,
(b) the maximum communication distance,
(c) the maximum power dissipation,
(d) the output power of the transmitter and sensitivity of the
receiver,
(e) the electro-magnetic compatibility (EMC) and the electro-magnetic
interference (EMI) of the wireless system with the other on-chip
elements.


A silicon implementation of a wireless interconnects system at 15GHz
:: (c) the placement of the wireless nodes in a given network topology constrained to the maximum possible communication distance,
is presented in [2]. Dynamic reconfiguration of the wireless links
between multiple frequencies is proposed in [8]. Design guidelines
for reducing the impact of on-chip metal structures
(i.e. interconnects and vias) on the performance and characteristics
of the on-chip antennas are provided in [9].


P-3) Wireless Communication Paradigm: The wireless communication
:: (d) the protocol to select the wireless short-cut path over the wired path.
paradigm models the communication channel. It provides the model for
the path loss between the antenna pair and the signal to noise ratio
(SNR) requirement based on the required bit-error-rate (BER) from the
wireless communication channel. The SNR places constraints on:
(a) the maximum wirelessly communicable distance,
(b) the required output power from the transmitter,
(c) the required sensitivity of the receiver.
These constraints in turn determine the power requirements of the
transceiver. The SNR requirement can be eased by utilizing
error-correction coding (ECC).


The wireless interconnect channel is modeled and characterized for the
It is proposed in [6], for instance, that the entire network be broken up into subnets of computational cores with top-level hubs connected with wireless ports for the high speed  links conforming to a small-world topology. Protocols for a collision free and quality of service (QoS)-aware hybrid wireless NoCs, in presence of multiple antennas at the same carrier frequency, are presented in [7].
path loss and delay spread in [10] and the BER and SNR for the
wireless interconnect system are analyzed in [11] and [12],
respectively.


In summary, the design of the hybrid NoC architectures using wireless
; P-2) Physical Implementation Paradigm: The physical implementation paradigm considers both the antenna design and the transceiver design. The antenna and the transceiver design depend on:
on-chip interconnects can potentially provide high throughput and
 
energy savings in 2D and 3D MPSoCs. However, their adaptability and
:: (a) the carrier frequency and the required bandwidth,
benefits depend on the integration of the multiple facets involved in
 
the design of such complex systems.
:: (b) the maximum communication distance,
 
:: (c) the maximum power dissipation,
 
:: (d) the output power of the transmitter and sensitivity of the receiver,
 
:: (e) the electro-magnetic compatibility (EMC) and the electro-magnetic interference (EMI) of the wireless system with the other on-chip elements.
 
A silicon implementation of a wireless interconnects system at 15GHz is presented in [2]. Dynamic reconfiguration of the wireless links between multiple frequencies is proposed in [8]. Design guidelines for reducing the impact of on-chip metal structures (i.e. interconnects and vias) on the performance and characteristics of the on-chip antennas are provided in [9].
 
; P-3) Wireless Communication Paradigm: The wireless communication paradigm models the communication channel. It provides the model for the path loss between the antenna pair and the signal to noise ratio (SNR) requirement based on the required bit-error-rate (BER) from the wireless communication channel. The SNR places constraints on:
 
:: (a) the maximum wirelessly communicable distance,
 
:: (b) the required output power from the transmitter,
 
:: (c) the required sensitivity of the receiver.
 
These constraints in turn determine the power requirements of the transceiver. The SNR requirement can be eased by utilizing error-correction coding (ECC).
 
The wireless interconnect channel is modeled and characterized for the path loss and delay spread in [10] and the BER and SNR for the wireless interconnect system are analyzed in [11] and [12], respectively.
 
In summary, the design of the hybrid NoC architectures using wireless on-chip interconnects can potentially provide high throughput and energy savings in 2D and 3D MPSoCs. However, their adaptability and benefits depend on the integration of the multiple facets involved in the design of such complex systems.


References
References


[1] M. F. Chang, V. P. Roychowdhury, L. Zhang, H. Shin and Y. Qian,
[1] M. F. Chang, V. P. Roychowdhury, L. Zhang, H. Shin and Y. Qian, "RF/Wireless Interconnect for Inter- and Intra-chip Communications," Proceedings of the IEEE, vol. 89, pp. 456-466, April 2001.
"RF/Wireless Interconnect for Inter- and Intra-chip Communications,"
Proceedings of the IEEE, vol. 89, pp. 456-466, April 2001.


[2] B. A. Floyd, C.-M. Hung and K.K. O, "Intra-chip Wireless
[2] B. A. Floyd, C.-M. Hung and K.K. O, "Intra-chip Wireless Interconnect for Clock Distribution Implemented with Integrated Antennas, Receivers and Transmitters," IEEE Journal of Solid-State Circuits, vol. 37, pp. 543-551, May 2002.
Interconnect for Clock Distribution Implemented with Integrated
Antennas, Receivers and Transmitters," IEEE Journal of Solid-State
Circuits, vol. 37, pp. 543-551, May 2002.


[3] N. Miura et al., "A 0.14pJ/b inductive-coupling transceiver with
[3] N. Miura et al., "A 0.14pJ/b inductive-coupling transceiver with digitally-controlled precise pulse shaping," IEEE Journal of Solid-State Circuits, pp. 285-291, January 2008.
digitally-controlled precise pulse shaping," IEEE Journal of
Solid-State Circuits, pp. 285-291, January 2008.


[4] A. Fazzi et al., "3D capacitive interconnections with mono- and
[4] A. Fazzi et al., "3D capacitive interconnections with mono- and bi- directional capabilities," IEEE Journal of Solid-State Circuits, pp. 275-284, January 2008.
bi- directional capabilities," IEEE Journal of Solid-State Circuits,
pp. 275-284, January 2008.


[5] A. More and B. Taskin, "A Unified Design Methodology for a Hybrid
[5] A. More and B. Taskin, "A Unified Design Methodology for a Hybrid Wireless 2-D NoC," IEEE International Symposium on Circuits and Systems (ISCAS), 2012.
Wireless 2-D NoC," IEEE International Symposium on Circuits and
Systems (ISCAS), 2012.


[6] S. Deb, A. Ganguly, K. Chang, P. Pande, B. Beizer, and D. Heo,
[6] S. Deb, A. Ganguly, K. Chang, P. Pande, B. Beizer, and D. Heo, "Enhancing Performance of Network-on-chip Architectures with Millimeter-wave Wireless Interconnects," IEEE International Conference on Application-specific Systems Architectures and Processors (ASAP), 2010, pp. 73-80.
"Enhancing Performance of Network-on-chip Architectures with
Millimeter-wave Wireless Interconnects," IEEE International Conference
on Application-specific Systems Architectures and Processors (ASAP),
2010, pp. 73-80.


[7] D. Zhao and Y. Wang, "SD-MAC: Design and Synthesis of a Hardware-
[7] D. Zhao and Y. Wang, "SD-MAC: Design and Synthesis of a Hardware- Efficient Collision-free QoS-aware MAC Protocol for Wireless Network-on- chip," IEEE Transactions on Computers, vol. 57, pp. 1230-1245, 2008.
Efficient Collision-free QoS-aware MAC Protocol for Wireless
Network-on- chip," IEEE Transactions on Computers, vol. 57,
pp. 1230-1245, 2008.


[8] A. More and B. Taskin, "EM and Circuit Co-simulation of a
[8] A. More and B. Taskin, "EM and Circuit Co-simulation of a Reconfigurable Hybrid Wireless NoC on 2D ICs," IEEE International Conference on Computer Design (ICCD), 2011, pp. 19-24.
Reconfigurable Hybrid Wireless NoC on 2D ICs," IEEE International
Conference on Computer Design (ICCD), 2011, pp. 19-24.


[9] A. B. M. H. Rashid et al., "Interference Suppression of Wireless
[9] A. B. M. H. Rashid et al., "Interference Suppression of Wireless Interconnection in Si Integrated Antenna," IEEE International Interconnect Technology Conference (IITC), 2002, pp. 173-175.
Interconnection in Si Integrated Antenna," IEEE International
Interconnect Technology Conference (IITC), 2002, pp. 173-175.


[10] M. Sun, Y. P. Zhang, G. X. Zheng, and W. Y. Yin, "Performance of
[10] M. Sun, Y. P. Zhang, G. X. Zheng, and W. Y. Yin, "Performance of intra-chip wireless interconnect using on-chip antennas and UWB radios," IEEE Transactions on Antennas and Propagation, vol. 57, pp. 2756-2762, September 2009.
intra-chip wireless interconnect using on-chip antennas and UWB
radios," IEEE Transactions on Antennas and Propagation, vol. 57,
pp. 2756-2762, September 2009.


[11] Y. P. Zhang, "Bit-error-rate Performance of Intra-chip Wireless
[11] Y. P. Zhang, "Bit-error-rate Performance of Intra-chip Wireless Interconnect Systems," IEEE Communications Letters, vol. 8, pp. 39-41, January 2004.
Interconnect Systems," IEEE Communications Letters, vol. 8, pp. 39-41,
January 2004.


[12] D. Bravo et al., "Estimation of the Signal-to-noise Ratio for
[12] D. Bravo et al., "Estimation of the Signal-to-noise Ratio for On-chip Wireless Clock Signal Distribution," IEEE International Interconnect Technology Conference (IITC), 2000, pp. 9-11.
On-chip Wireless Clock Signal Distribution," IEEE International
Interconnect Technology Conference (IITC), 2000, pp. 9-11.

Latest revision as of 09:55, 3 February 2012

Sigdafeb12.png

What is Wireless On-Chip Interconnect?

Wireless on-chip interconnects are a radio-frequency (RF) alternative to metal interconnects for global communication on an IC. RF interconnect channels are based on:

  1. On-chip micro-strip transmission lines [1],
  2. On-chip antennas [2],
  3. On-chip inductors based inductive coupling [3],
  4. On-chip capacitors based capacitive coupling [4].

The micro-strip lines are used as guided-wave RF interconnects (RF-I[1]) on a layer for lateral communication whereas the other three are configured as wireless RF interconnects used for lateral or vertical communication.

The wireless interconnects are not envisioned to antiquate the metal based interconnects but rather to be implemented in conjunction to provide hybrid communication structures and networks-on-chip (NoC), particularly for 2D or 3D multi-processor system-on-chips (MPSoCs). The design of the wireless RF interconnects for all systems in general but for multi-core systems in particular requires considerations across a vast variety of subjects including, electro-magnetic theory, network theory, wireless communication, VLSI design and design automation. The multi-faceted design considerations are categorized according to three primary design paradigms [5]:

P-1) Information Networking Paradigm
The information networking paradigm considers higher level hybrid architectural design variables:
(a) the architecture of the hybrid NoC using the wireless interconnects,
(b) the number of wireless nodes and the arbitration protocol,
(c) the placement of the wireless nodes in a given network topology constrained to the maximum possible communication distance,
(d) the protocol to select the wireless short-cut path over the wired path.

It is proposed in [6], for instance, that the entire network be broken up into subnets of computational cores with top-level hubs connected with wireless ports for the high speed links conforming to a small-world topology. Protocols for a collision free and quality of service (QoS)-aware hybrid wireless NoCs, in presence of multiple antennas at the same carrier frequency, are presented in [7].

P-2) Physical Implementation Paradigm
The physical implementation paradigm considers both the antenna design and the transceiver design. The antenna and the transceiver design depend on:
(a) the carrier frequency and the required bandwidth,
(b) the maximum communication distance,
(c) the maximum power dissipation,
(d) the output power of the transmitter and sensitivity of the receiver,
(e) the electro-magnetic compatibility (EMC) and the electro-magnetic interference (EMI) of the wireless system with the other on-chip elements.

A silicon implementation of a wireless interconnects system at 15GHz is presented in [2]. Dynamic reconfiguration of the wireless links between multiple frequencies is proposed in [8]. Design guidelines for reducing the impact of on-chip metal structures (i.e. interconnects and vias) on the performance and characteristics of the on-chip antennas are provided in [9].

P-3) Wireless Communication Paradigm
The wireless communication paradigm models the communication channel. It provides the model for the path loss between the antenna pair and the signal to noise ratio (SNR) requirement based on the required bit-error-rate (BER) from the wireless communication channel. The SNR places constraints on:
(a) the maximum wirelessly communicable distance,
(b) the required output power from the transmitter,
(c) the required sensitivity of the receiver.

These constraints in turn determine the power requirements of the transceiver. The SNR requirement can be eased by utilizing error-correction coding (ECC).

The wireless interconnect channel is modeled and characterized for the path loss and delay spread in [10] and the BER and SNR for the wireless interconnect system are analyzed in [11] and [12], respectively.

In summary, the design of the hybrid NoC architectures using wireless on-chip interconnects can potentially provide high throughput and energy savings in 2D and 3D MPSoCs. However, their adaptability and benefits depend on the integration of the multiple facets involved in the design of such complex systems.

References

[1] M. F. Chang, V. P. Roychowdhury, L. Zhang, H. Shin and Y. Qian, "RF/Wireless Interconnect for Inter- and Intra-chip Communications," Proceedings of the IEEE, vol. 89, pp. 456-466, April 2001.

[2] B. A. Floyd, C.-M. Hung and K.K. O, "Intra-chip Wireless Interconnect for Clock Distribution Implemented with Integrated Antennas, Receivers and Transmitters," IEEE Journal of Solid-State Circuits, vol. 37, pp. 543-551, May 2002.

[3] N. Miura et al., "A 0.14pJ/b inductive-coupling transceiver with digitally-controlled precise pulse shaping," IEEE Journal of Solid-State Circuits, pp. 285-291, January 2008.

[4] A. Fazzi et al., "3D capacitive interconnections with mono- and bi- directional capabilities," IEEE Journal of Solid-State Circuits, pp. 275-284, January 2008.

[5] A. More and B. Taskin, "A Unified Design Methodology for a Hybrid Wireless 2-D NoC," IEEE International Symposium on Circuits and Systems (ISCAS), 2012.

[6] S. Deb, A. Ganguly, K. Chang, P. Pande, B. Beizer, and D. Heo, "Enhancing Performance of Network-on-chip Architectures with Millimeter-wave Wireless Interconnects," IEEE International Conference on Application-specific Systems Architectures and Processors (ASAP), 2010, pp. 73-80.

[7] D. Zhao and Y. Wang, "SD-MAC: Design and Synthesis of a Hardware- Efficient Collision-free QoS-aware MAC Protocol for Wireless Network-on- chip," IEEE Transactions on Computers, vol. 57, pp. 1230-1245, 2008.

[8] A. More and B. Taskin, "EM and Circuit Co-simulation of a Reconfigurable Hybrid Wireless NoC on 2D ICs," IEEE International Conference on Computer Design (ICCD), 2011, pp. 19-24.

[9] A. B. M. H. Rashid et al., "Interference Suppression of Wireless Interconnection in Si Integrated Antenna," IEEE International Interconnect Technology Conference (IITC), 2002, pp. 173-175.

[10] M. Sun, Y. P. Zhang, G. X. Zheng, and W. Y. Yin, "Performance of intra-chip wireless interconnect using on-chip antennas and UWB radios," IEEE Transactions on Antennas and Propagation, vol. 57, pp. 2756-2762, September 2009.

[11] Y. P. Zhang, "Bit-error-rate Performance of Intra-chip Wireless Interconnect Systems," IEEE Communications Letters, vol. 8, pp. 39-41, January 2004.

[12] D. Bravo et al., "Estimation of the Signal-to-noise Ratio for On-chip Wireless Clock Signal Distribution," IEEE International Interconnect Technology Conference (IITC), 2000, pp. 9-11.