2008629

Award information

Award Number:2008629

Project Title:CNS Core: Small: Wireless Interconnect Networks on Multi-Die Systems

Report Type: Annual Project Report

PI:BarisTaskin

Awardee:Drexel University

NSF award page

Synopsis

Advances in semiconductor technology have enabled sophisticated computing systems to be integrated in small form-factor devices that are widely used in not only in computers, but in consumer electronics such as cellphones and have enabled a host of applications, such as the internet-of-things, wearable electronics, portable medical devices, etc. The integration of multiple computing and storage units in a single semiconductor device necessitates the scaling of networking science, typically developed for constraints between computers (such as the internet), down to a single-chip level, in order to enable efficient communication between on-chip elements. This enables data-center-like operation on an individual chip populated with hundreds of processing elements, with computation capabilities that are equivalent to a network of computers, but with much improved portability, cost-effectiveness and energy-efficiency. Such advancements are important to maintain US leadership of the computing, networking and semiconductor industries, as well as improving the connectivity of national human resources and the physical infrastructure.

This project investigates computing system, VLSI, antenna design and networking principles for the integration of a novel Through-Silicon-Via-Antenna (TVSA)-based wireless network system into semiconductor devices packaged in the form factor of heterogeneous multi-die integration. The proposed wireless network for multi-die systems aims to create a scalable, reliable, and efficient network interconnect for current and emerging industry-standard multi-die processors. Through-Silicon-Via-Antennas are highly suited for on-chip wireless communication at minuscule footprints. This project focuses on the following tasks: (a) design and characterization of on-package TSVA; (b) wireless propagation modelling and channel characterization for multi-die systems using a Software Defined Radio (SDR) prototyping testbed; and (c) interconnect network system design by considering routing, latency, and throughput via cycle-accurate system-level simulations.

This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.

Personnel

Faculty

Prof. Baris Taskin (PI, Drexel University) Prof. Kapil Dandekar (Co-PI, Drexel University)

PhD Students

Vasil Pano, PhD. (graduated) Ragh Kuttappa, Ph.D. (graduated) Scott Lerner (graduated) Sief Atari Yilmaz Gonul Ceyhun Kayan

MS Students

Angela Wei., MS (graduated)

Collaborators

Prof. Ibrahim Tekin (Visiting faculty contributor, Sabanci University, Turkey)

Publications

Publications list is updated 2022/10. For updates, see Publications

• A. Ganguly, S. Abadal, I. Thakkar, N. E. Jerger, M. Riedel, M. Babaie, R. Balasubramonian, A. Sebastian, S. Pasricha, B. Taskin, A. Ganguly et al., "Interconnects for DNA, Quantum, In-Memory, and Optical Computing: Insights From a Panel Discussion," IEEE Micro, vol. 42, no. 3, pp. 40-49, 1 May-June 2022, doi: 10.1109/MM.2022.3150684.

• Ragh Kuttappa, Baris Taskin, Scott Lerner, and Vasil Pano, "Resonant Clock Synchronization with Active Silicon Interposer for Multi-Die Systems", IEEE Transactions on Circuits and Systems I: Regular Papers (TCAS-I), Vol. 68, No. 4, pp. 1636--1645, April 2021. PAPER

• Vasil Pano, Ibrahim Tekin, Isikcan Yilmaz, Yuqiao Liu, Kapil R. Dandekar, and Baris Taskin, "TSV Antennas for Multi-Band Wireless Communication", IEEE Journal on Emerging and Selected Topics in Circuits and Systems (JETCAS), March 2020. PRE-PRINT

• Vasil Pano, Ibrahim Tekin, Yuqiao Liu, Kapil R. Dandekar, and Baris Taskin, "TSV-based Antenna for On-Chip Wireless Communication", IET Microwaves, Antennas & Propagation (MAP), December 2019. PRE-PRINT

• Yuqiao Liu, Oday Bshara, Ibrahim Tekin, Christopher Israel, Ahmad Hoorfar, Baris Taskin, and Kapil Dandekar, "Design and Fabrication of a Two-Port Three-Beam Switched Beam Antenna Array for 60 GHz Communication", IET Microwaves, Antennas & Propagation, Vol. 13, No. 9, pp. 1438--1442, July 2019. PAPER

• Ragh Kuttappa, Steven Khoa, Leo Filippini, Vasil Pano, and Baris Taskin, "Comprehensive Low Power Adiabatic Circuit Design with Resonant Power Clocking", Proceedings of the IEEE International Symposium on Circuits and Systems (ISCAS), May 2020. PAPER

• Vasil Pano, Ragh Kuttappa, and Baris Taskin, "3D NoCs with Active Interposer for Multi-Die Systems", Proceedings of the IEEE/ACM International Symposium on Networks-on-Chip (NOCS), October 2019. PAPER

• Vasil Pano, Ibrahim Tekin, Yuqiao Liu, Kapil R. Dandekar, and Baris Taskin, "In-Package Wireless Communication with TSV-based Antenna", IEEE International Symposium on Circuits and Systems Late Breaking News (ISCAS-LBN), May 2019. PAPER

• Oday Bshara, Yuqiao Liu, Ibrahim Tekin, Baris Taskin, and Kapil R. Dandekar, "mmWave Antenna Gain Switching to Mitigate Indoor Blockage", Proceedings of the IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting (APS-URSI), July 2018. PAPER

• Vasil Pano, Scott Lerner, Isikcan Yilmaz, Michael Lui, and Baris Taskin, "Workload-Aware Routing (WAR) for Network-on-Chip Lifetime Improvement", Proceedings of the IEEE International Symposium on Circuits and Systems (ISCAS), May 2018. PAPER

• Scott Lerner, Vasil Pano, and Baris Taskin, "NoC Router Lifetime Improvement using Per-Port Router Utilization", Proceedings of the IEEE International Symposium on Circuits and Systems (ISCAS), May 2018. PAPER

• Angela Wei, M.S. thesis, "Novel Wireless Non-Uniform Multi-Die Systems", 2021

• Vasil Pano, Ph.D. Dissertation: Wireless Network on Chip for Multi-Die Systems, 2019

Code

Code release for wireless multi-die system simulations:

https://github.com/aw868/new_aw868_gem5

Educational activities

Independent research projects at the graduate level for Angela Wei

Post-doc mentoring by PIs

Post-Doc career development by advising MS level graduate research and REU

Outreach and other broader impact outcomes

Institution Open Houses for high school students

Panel discussion and position paper on wireless interconnects

Vertically Integrated Projects - disrupted by Covid break

Presentation of conference research work on video, released and available by conference sponsors (some publicly available for limited time)

Invention disclosure: https://patents.google.com/patent/US11329362B2/en?oq=US11329362B2

edited 10/20222