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Contact Information

Email: jyang@tda-i.com

Jungho Yang

Postdoctoral Researcher

2016-2017
“Molecular Simulations of Bio-based Thermosets”

S. Ding, I. Ullah, S. Y. Gong, J. Grover, M. Mohammadi, Y. Chen, D. Vézina, G. Beaudoin-Bussières, V. T. Verma, G. Goyette, F. Gaudette, J. Richard, D. Yang, A. Smith III, M. Pazgier, M. Côté, C. Abrams, P. Kumar, W. Mothes, P. Uchil, A. Finzi, and C. Baron, “VE607 Stabilizes SARS-CoV-2 Spike In the RBD-up Conformation and Inhibits Viral Entry,” iScience, 2022. [Bibtex] [doi]
@Article{Ding2022,
author={Ding, Shilei
and Ullah, Irfan
and Gong, Shang Yu
and Grover, Jonathan
and Mohammadi, Mohammadjavad
and Chen, Yaozong
and V{\'e}zina, Dani
and Beaudoin-Bussi{\`e}res, Guillaume
and Verma, Vijay Tailor
and Goyette, Guillaume
and Gaudette, Fleur
and Richard, Jonathan
and Yang, Derek
and A. Smith III,
and Pazgier, Marzena
and C{\^o}t{\'e}, Marceline
and Abrams, Cameron
and Kumar, Priti
and Mothes, Walther
and Uchil, Pradeep
and Finzi, Andr{\'e}s
and Baron, Christian},
title={{VE607 Stabilizes SARS-CoV-2 Spike In the RBD-up Conformation and Inhibits Viral Entry}},
journal={{iScience}},
year={2022},
month={2022/06/06},
publisher={Elsevier},
issn={2589-0042},
doi={10.1016/j.isci.2022.104528},
url={https://doi.org/10.1016/j.isci.2022.104528}
}

J. H. Yang, A. Srikanth, C. Jang, and C. F. Abrams, “Relationships between molecular structure and thermomechanical properties of bio-based thermosetting polymers,” Journal of Polymer Science Part B: Polymer Physics, vol. 55, iss. 3, p. 285–292, 2016. [Bibtex] [doi]
@article{Yang_2016,
doi = {10.1002/polb.24270},
url = {https://doi.org/10.1002%2Fpolb.24270},
year = 2016,
month = {nov},
publisher = {Wiley},
volume = {55},
number = {3},
pages = {285--292},
author = {Jung Ho Yang and Arun Srikanth and Changwoon Jang and Cameron F. Abrams},
title = {Relationships between molecular structure and thermomechanical properties of bio-based thermosetting polymers},
journal = {{Journal of Polymer Science Part B: Polymer Physics}}
}

Professional Experience

  1. 2018-
    Engineer
    Technical Data Analysis, Inc.