I was born and raised in Rochester, New York in December, 1982. I enjoy watching, playing, and coaching soccer, reading, chess, tennis, and spending time with my family. My large Greek and Peruvian family, which includes my wife, Ana Lucia, and son, Ioannis Alexander, bring me all the happiness in the world. An interesting fact that many people don’t know about me is that, although I was born in Rochester, I did not learn English until my early years in elementary school. My family spoke primarily Greek at home, and therefore, I learned English as a second language.
I received the B.S.E. degree in Electrical and Computer Engineering and Biomedical Engineering from Duke University, Durham, NC, in 2005. I received the M.Sc. degree in Electrical and Computer Engineering from the University of Rochester, Rochester, NY, in 2007, and have completed the Ph.D. degree in Electrical and Computer Engineering under the guidance of Professor Eby G. Friedman.
Professional Experience
I interned at Freescale Semiconductor Corporation, Austin, TX, during the summers of 2006 and 2007, where he worked on the electrical characterization and modeling of interplane 3-D vias. During the summers of 2008, 2009, and 2010 I interned at the IBM T. J. Watson Research Center, Yorktown Heights, NY. While there, I worked on electrical characterization and modeling, reticle design, and DC and high frequency electrical measurements of test vehicles implementing various interplane 3-D via topologies.
My research interests include analysis, modeling, and design methodologies for high performance digital and mixed-signal integrated circuits, emerging integrated circuit technologies, and interconnect related issues, with an emphasis on electrical and thermal modeling and characterization, signal and power integrity, and power and clock delivery for 3-D integrated circuit technologies.
Education
University of Rochester, Rochester, NY; Ph.D. Electrical and Computer Engineering , advised by Prof. Eby G. Friedman. Dissertation titled Characterization and Modeling of TSV Based 3-D Integrated Circuits, August 2013.
University of Rochester, Rochester, NY; M.S. Electrical and Computer Engineering, May 2007.
Duke University, Durham, NC; B.S.E. Electrical and Computer Engineering; Biomedical Engineering, May 2005.
